THROUGH-HOLE SOLDERING GENERAL REQUIREMENTS
IPC-2221 & 2222 and Through-hole Pad Stacks - PCB Libraries Forum
Device Connection Integration in the SMT Process
The IPC-7351 Specification Explained: SOIC Components – SnapMagic Blog
Best Practices in Manufacturing: Wave Soldering - VEXOS
Design Rules For Selective Soldering Assemblies
RoHS-Compliant Through-Hole VI Chip® Soldering Recommendations
IPC J-STD-001 Standard for Soldering | Sierra Circuits
Device Connection Integration in the SMT Process
The Basics of Soldering — Part 2 | Servo Magazine
WE-RJ45 LAN for Through-Hole Reflow
A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
7.1.3 Solder Joint Acceptance Criteria
Through-Hole Assembly Design Rules | Seirra Circuits
Wave soldering successfully replaced
Criteria for PCB Assembly - PCB Assembly Standard | Viasion
IPC J-STD-001 Standard for Soldering | Sierra Circuits
7.1.3 Solder Joint Acceptance Criteria
soldering - Does the PCB have to be thinner than through-hole pin length? - Electrical Engineering Stack Exchange
Through-Hole Solder Joint Evaluation
Design Rules For Selective Soldering Assemblies
pcb - PTH drill diameter do the IPC take the pin distance in account? - Electrical Engineering Stack Exchange
Through-Hole Solder Joint Evaluation
Design Rules For Selective Soldering Assemblies
ANP078: WE-RJ45 LAN for Through-Hole Reflow - element14 Community
