AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
Via in Pad Guidelines - Bittele Electronics
PCB layout for SMPS - Part 2 of 2 | Video | TI.com
PCB-cooling techniques and strategies for IC packages - Electronic Products
TPS548D21: Via requirement for Thermal pad - Power management forum - Power management - TI E2E support forums
heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange
Thermal management - Multi Circuit Boards
PowerPAD Layout Guidelines
AN-2020 Thermal Design By Insight, Not Hindsight (Rev. C)
PCB Thermal Management Techniques - Technical Articles
heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange
PowerPAD™ Thermally Enhanced Package (Rev. H)
heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange
heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange
Thermal Vias Management for PCBs
heatsink - Optimize heat sink design - connect cooling pad on PCB backside by vias - Electrical Engineering Stack Exchange
PowerPAD Layout Guidelines
Accurate Thermal Calculations on the Back of a Napkin
Thermal Comparison of FR-4 and Insulated Metal Substrate PCB for GaN Inverter
PowerPAD Layout Guidelines
Thermal Design and Performance of Top-Side Cooled QFN 12x12 Package
Optimizing PCB Thermal Performance | DigiKey
Thermal management - Multi Circuit Boards
Thermal Vias: Maximize Effectiveness in PCB Design - EDN
PCB Thermal Management Techniques - Technical Articles
TAS5110 Datasheet by Texas Instruments | Digi-Key Electronics
